New Qualcomm Chipset to be Named Snapdragon 855 and Manufactured by TSMC

Montelent December 4, 2018
Qualcomm Snapdragon 855

Qualcomm is having its annual meeting in Hawaii, the United States, where it usually announces the new version of its flagship chipset for mobile devices. According to Twitter leakster Roland Quandt, the platform will be called Snapdragon 855 and will be manufactured on the 7nm process by TSMC. The Snapdragon 8150 was the internal name of the new platform, but it will not be used for marketing purposes.

The Snapdragon 855 will have a Snapdragon X50 modem, built specifically to answer demands for 5G connectivity. The CPU will feature three clusters, the mightiest clocked at 2.84 GHz, while the GPU will be Adreno 640.

Snapdragon 855 will have an integrated NPU for improved AI performance. Qualcomm is also going to introduce Elite Gaming optimizations as a competition to Huawei’s GPU Turbo and Oppo’s Hyper Boost. An official announcement with full details is expected by the end of the week.

Source (in German)

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